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A Product Line of
Diodes Incorporated
ZXMP10A13F
Maximum Ratings (@T A = +25°C, unless otherwise specified.)
Drain-Source Voltage
Gate-Source Voltage
Characteristic
(Note 6)
Symbol
V DSS
V GS
Value
-100
±20
-0.7
Units
V
V
Continuous Drain Current
V GS = 10V
T A = +70°C
(Note 6)
I D
-0.5
A
(Note 5)
-0.6
Pulsed Drain Current (Note 7)
Continuous Source Current (Body Diode) (Note 6)
Pulsed Source Current (Body Diode) (Note 7)
I DM
I S
I SM
-3.1
-1.1
-3.1
A
A
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
Linear Derating Factor
Power Dissipation (Note 6)
Linear Derating Factor
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Leads (Note 8)
Operating and Storage Temperature Range
Symbol
P D
P D
R θ JA
R θ JA
R θ JL
T J, T STG
Value
625
5
806
6.4
200
155
194
-55 to +150
Unit
mW
mW/°C
mW
mW/°C
°C/W
°C/W
°C/W
°C
Notes:
5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
6. For a device surface mounted on FR4 PCB measured at t ≤ 5 secs.
7. Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10 μ s - pulse current limited by maximum junction temperature.
8. Thermal resistance from junction to solder-point (at the end of the drain lead).
ZXMP10A13F
Document number: DS33596 Rev. 3 - 2
2 of 8
www.diodes.com
October 2013
? Diodes Incorporated
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